Vertical integration provides routes to build small footprint 3D integrated system that improves power, performance, area, and cost of electronics. The article presents vertical interconnect structures developed using two different types of high-resolution printers (electrohydrodynamic and extrusion-based direct-ink writing) for the development of high-density 3D integrated flexible hybrid electronic (FHE) systems. Comprehensive studies comparing and benchmarking of: (i) speed and throughput of the high-resolution printers, (ii) electrical performance of vertically interconnected transistors in ultra-thin chips, and (iii) performance stability of heterogenous system under mechanical bending, are presented. The study opens exciting avenues for compact, out of plane flexible electronics using resource-efficient manufacturing.
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