International Conference(s):

  1. S. Ma, A. S. Dahiya, A. Christou, R. Dahiya, “3D Printed Interconnects for Heterogenous Integration on Flexible Substrates,” The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Tampere, Finland, June 2024.
  2. S. Ma, A. S. Dahiya, A. Christou, R. Dahiya, “3D Printed Interconnects for Heterogenous Integration on Flexible Substrates”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Tampere, Finland, June , 2024.
  3. J. Neto, A. S. Dahiya, A. Zumeit, A. Christou, R. Dahiya, “Multi-Gate Transistors on Flexible Substrates as building blocks for Neuromorphic Electronic Skin”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Tampere, Finland, June , 2024.
  4. C. S. Lee, M. Li, Y. Lou, R. Dahiya, “Design of a Robust Lung Sound Acquisition System for Reliable Acoustic Lung Imaging”, IEEE International Ultrasonics Symposium (IUS), Montreal, Canada, Sept , 2023.
  5. L. De Pamphilis, A. S. Dahiya, S. Ma, R. Dahiya, “Printed Memristors Using Hydrothermally Grown Zinc Oxide Nanowires”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Boston, USA, July , 2023.
  6. S. Ma, A. S. Dahiya, X. Karagiorgis, R. Dahiya, “Ultra-Thin Chips for High-Performance Semi-Transparent Flexible Electronics”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Boston, USA, July , 2023.
  7. F. Liu, R. Chirila, A. Christou, R. Dahiya, “Fabrication and Statistical Analysis of Large-Scale ZnO NW Based Synaptic Transistors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Boston, USA, July , 2023.
  8. J. Neto, A. S. Dahiya, A. Christou, A. Zumeit, L. De pamphilis, R. Dahiya, “Dual-Gate Transistors Using Contact Printed ZnO Nanowires”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Boston, USA, July , 2023.
  9. X. Karagiorgis, F. Liu, S. Sandhu, P. Skabara, R. Dahiya, “Electrospun PANi Nanofibers for Biodegradable Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS), Boston, USA, July , 2023.
  10. D. K. Neethipathi, A. Beniwal, P. Ganguly, A. Bass, M. Scott, R. Dahiya, “Electrochemical detection of Fe2+ ions in water using 2-Dimensional g-C3N4 modified Glassy carbon electrode-based sensor”, IEEE Applied Sensing Conference (APSCON), Bengaluru, India, Jan , 2023.
  11. N. M. Nair, D. Shakhtivel, R. Dahiya, “Transparent Flexible Capacitive Pressure Sensor Array”, IEEE Applied Sensing Conference (APSCON), Bengaluru, India, Jan , 2023.
  12. R. Chirila, A. S. Dahiya, P. Schyns, R. Dahiya, “Micromolding-in-Capillary based Fabrication of Liquid Metal Patterned Structures for Soft Robotics”, IEEE Applied Sensing Conference (APSCON), Bengaluru, India, Jan , 2023.
  13. C. Parameswaran, D. Shakthivel, R. Dahiya, “Fabrication of Silk nanofibers with in-situ Crystallization for Large-area Tactile Sensing”, IEEE Applied Sensing Conference (APSCON), Bengaluru, India, Jan , 2023.
  14. X. Karagiorgis, A. Beniwal, P. Skabara, R. Dahiya, “Degradable nanofibers-based capacitive pressure sensor for underwater monitoring”, IEEE Applied Sensing Conference (APSCON), Bengaluru, India, Jan , 2023.
  15. F. Liu, R. Dahiya, “Electronic skin with “bio-like” learning capability”, MEMRISYS, Boston, USA, Dec , 2022.
  16. J. Neto, R. Chirila, A. S. Dahiya, F. Liu, R. Dahiya, “Printed Electronic Skin allowing Robots to Feel, Learn and Mimick the Mechanical and Thermal Pain Reflexes”, MRS Fall Symposium, Boston, USA, Nov , 2022.
  17. P. K. Murali, C. Wang, D. Lee, R. Dahiya, M. Kaboli, “Deep Active Cross-Modal Visuo-Tactile Transfer Learning for Robotic Object Recognition”, 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2022), Kyoto, Japan, Oct , 2022.
  18. A. Christou, A. Zumeit, A. S. Dahiya, R. Dahiya, “Printed Inorganic Nanostructures based Electronic Layers for High Performance Flexible and Transient Electronics”, European MRS Fall Symposium, Warsaw, Poland, Sept , 2022.
  19. A. S. Dahiya, R. Dahiya, “Printing Techniques for Integration of Inorganic Nanomaterials on Flexible and Biodegradable Substrates”, The IEEE Flexible Electronics Technology Conference (IFETC 2022), Qingdao, China, Aug , 2022.
  20. G. Khandelwal, A. S. Dahiya, R. Dahiya, “Yarn based UV photodetectors for E-textiles”, The IEEE Flexible Electronics Technology Conference (IFETC 2022), Qingdao, China, Aug , 2022.
  21. P. K. Murali, R. Dahiya, M. Kaboli, “An empirical evaluation of various information gain criteria for active tactile action selection for pose estimation”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  22. P. K. Murali, C. Wang, R. Dahiya, M. Kaboli, “Towards Robust 3D Object Recognition with Dense-to-Sparse Deep Domain Adaptation”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  23. O. Ozioko, R. Dahiya, “Spray Coated Piezoresistive Bend Sensor for Controlled Movements in Soft Robots”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  24. S. Ma, A. S. Dahiya, R. Dahiya, “Direct Write 3D-Printed Interconnects for Heterogenous Integration of Ultra Thin Chips”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  25. S. Mishra, M. Shojaei Baghini, D. Shakthivel, B. Rai, R. Dahiya, “Sensitivity Analysis of ZnO NWs Based Soft Capacitive Pressure Sensors Using Finite Element Modeling”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  26. M. Shojaei Baghini, R. Dahiya, “Direct Ink Writing of Tunnelling Graphite Based Soft Piezoresistive Pressure Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  27. D. Shakthivel, A. Christou, A. S. Dahiya, R. Dahiya, “Growth Kinetics and Integration of Inorganic Nanowires for Flexible Electronics”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  28. R. Mukherjee, A. S. Dahiya, R. Dahiya, “Torsional and Bending Endurance Analysis of screen-Printed Interconnects on Various Flexible Substrates”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  29. A. Christou, A. S. Dahiya, R. Dahiya, “Finite Element Analysis of Stress Distribution in Soft Sensors Under Torsional Loading”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  30. G. Min, G. Khandelwal, A. S. Dahiya, D. M. Mulvihill, R. Dahiya, “Textile Triboelectric Nanogenerators As Self-Powered Wearable Temperature Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  31. A. K. Aliyana, A. Baburaj, N. Kumar S K, R. Dahiya, “Impact of Analyte Ph on the Sensitivity of Screen-Printed Flexible Ammonium Sensor”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  32. L. De Pamphilis, A. Christou, A. S. Dahiya, R. Dahiya, “Selective Removal of Contact Printed Nanowires for lithography-Free Patterning”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  33. M. Chakraborty, R. Mukherjee, R. Dahiya, “Reliability Analysis of Screen-Printed Tags with Low-Power Electronics on Flexible Substrates”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  34. S. Ma, A. S. Dahiya, A. Christou, R. Dahiya, “All-Printed ZnO Nanowire Based High Performance Photodetectors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  35. A. Zumeit, A. S. Dahiya, A. Christou, R. Dahiya, “High Performance n- and p-Channel Flexible Transistors Using Roll Printed Silicon nanoribbons”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  36. R.Chirila, O. Ozioko, P. G. Schyns, R. Dahiya, “Multidirectional Strain Sensor Using multimaterial 3D Printing”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  37. G. Khandelwal, A. S. Dahiya, R. Dahiya, “V2O5 Nanowires Coated Yarn Based Temperature Sensor for Smart Textiles”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  38. J. Neto, A. S. Dahiya, R. Dahiya, “Influence of Encapsulation on the Performance of V2O5 Nanowires-Based Temperature Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  39. H. Nassar, R. Dahiya, “3D Printed Embedded Strain Sensor with Enhanced Performance”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  40. D. K. Neethipathi, P. Ganguli, A. Beniwal, M. Scott, A. Bass, R. Dahiya, “MoS2 Modified Screen Printed Carbon Electrode Based Flexible Sensor for Detection of Copper”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  41. P. Ganguli, D. K. Neethipathi, A. Beniwal, R. Dahiya, “Influence of Thickness of Screen Printed Carbon Electrodes on Electrochemical Sensing”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  42. A. Beniwal, P. Ganguli, D. K. Neethipathi, R. Dahiya, “PEDOT:PSS Modified Screen Printed Graphene-Carbon Ink Based Flexible Humidity Sensor”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  43. F. Liu, M. Chakraborty, A. Christou, M. Shojaei Baghini, R. Dahiya, “Sensorimotor Correlation Using Printed Synaptic Transistors and Conditioning PCB”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  44. X. Karagiorgis, M. Ntagios, P. Skabara, R. Dahiya, “3D-Printed Elastomer foam-Based Soft Capacitive Pressure Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2022), Vienna, Austria, July , 2022.
  45. F. Liu, S. Deswal, A. Christou, M. Shojaei Baghini, R. Chirila, D. Shakthivel, M. Chakraborty, R. Dahiya, “Computational E-Skin using Next Generation Printed Electronics”, MRS Spring Symposium,, Hawaii, USA, May , 2022.
  46. A. Zumeit, A. S. Dahiya, A. Christou, D. Shakthivel, F. Liu, R. Dahiya, “Direct roll transfer printed transistors for high-performance flexible electronics”, 2021 Int. Conf. on Solid State Devices and Materials,, Sapporo, Japan, Sept. , 2021.
  47. M. Bhattacharjee, R. Dahiya, “Chipless Sensing Antenna and an NFC Smart-Tag for Temperature Measurement”, 34th URSI GASS 2021, Rome, Italy, Aug , 2021.
  48. R. Mukherjee, R. Dahiya, “Life Cycle Assessment of Energy Generating Flexible Electronic Skin”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  49. F. Nikbakhtnasrabadi, E. S. Hosseini, R. Dahiya, “Flexible Strain Sensor Based on Printed LC Tank on Electrospun Piezoelectric Nanofibers”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  50. B. P. Yalagala, S. Deswal, S. R. K. Vanjari, R. Dahiya, “Silk fibroin-PVA Composite Based Bioresorbable Nanofibres for Transient Electronics”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  51. A. Christou, F. Liu, A. S. Dahiya, R. Dahiya, “Selective Printing of Electronic Layers for multi-Layered Devices Using Tailored Surface Morphology”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  52. E. S. Hosseini, L. Manjakkal, R. Dahiya, “Graphite-CuO Based Printed Potentiometric Ph Sensor for Water Quality Monitoring”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  53. D. Shakthivel, S. Santra, R. Dahiya, “Using Machine Learning to Predict the Statistical Distribution of Metal Nanoparticles”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  54. S. Dervin, E. S. Hosseini, R. Dahiya, “Porous Elastomer based Soft Pressure Sensor for Autonomous Underwater Vehicles”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  55. H. Matbouly, P. Escobedo, R. Dahiya, “A Flexible Metasurface QR Code for Simultaneous Identification and Sensing”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  56. J. Neto, A. S. Dahiya, Y. Kumaresan, D. Shakthivel, R. Dahiya, “V2O5 nanowires-based flexible temperature sensor”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  57. R. Chirila, O. Ozioko, R. Dahiya, “Analysis of a Soft Haptic Device with Integrated Tactile Sensor and Actuator for Optimal Design”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  58. A. Zumeit, A. S. Dahiya, D. Shakthivel, R. Dahiya, “Silicon nanoribbons Based Printed Transistors for high-Performance Flexible Electronics”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  59. Y. Kumaresan, S. Ma, D. Shakthivel, R. Dahiya, “AlN Ultra-Thin Chips Based Flexible Piezoelectric Tactile Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  60. A. Christou, A. S. Dahiya, F. Liu, D. Shakthivel, R. Dahiya, “Influence of the Vertical Alignment of Nanowires on the Quality of Printed Electronic Layers”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  61. G. Min, A. S. Dahiya, D. Mulvihill, R. Dahiya, “A Wide Range Self-Powered Flexible Pressure Sensor Based on Triboelectric nanogenerator”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  62. F. Liu, R. Dahiya, “Modelling of the Gate Capacitance in the Double Nanowire Based Field-Effect Transistors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  63. S. Ma, Y. Kumaresan, O. Ozioko, R. Dahiya, “Highly Sensitive Capacitive Pressure Sensor Enhanced with ZnO NW interlayers”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  64. M. Ntagiois, S. Dervin, R. Dahiya, “3D Printed Capacitive Pressure Sensing Sole for Anthropomorphic Robots”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  65. L. Manjakkal, R. Dahiya, “Graphene–Graphite Polyurethane Composite Based Wristband Supercapacitor for Wearable Electronics”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2021), Manchester, UK, June , 2021.
  66. A. Vilouras, R. Dahiya, “Ultra-Thin Chips with Current-Mode ISFET Array for Continuous Monitoring of Body Fluids pH”, IEEE ISCAS 2021,, Daegu, Korea, May , 2021.
  67. L. Manjakkal, A. Pullanchiyodan, R. Dahiya, “Development of Wearable Supercapacitor based on PEDOT: PSS Coated on Cellulose/Polyester Cloth”, E-MRS 2021 Spring Meeting, Strasbourg, France, May , 2021.
  68. P. Escobedo, M. Ntagios, R. Dahiya, “Electronic Skin with Energy Autonomous Proximity Sensing for Human-Robot Interaction”, IEEE Sensors Conference,, Rotterdam, The Netherlands, Oct. , 2020.
  69. E. Hosseini, R. Dahiya, “Biodegradable Amino acid-Based Pressure Sensor”, IEEE Sensors Conference,, Rotterdam, The Netherlands, Oct. , 2020.
  70. M. Bhattacharya, P. Escobedo, R. Dahiya, “Disposable and Flexible Sensor Patch for α-Amylase Detection in Human Blood Serum”, IEEE Sensors Conference,, Rotterdam, The Netherlands, Oct. , 2020.
  71. M. Ntagios, P. Escobedo, R. Dahiya, “3D Printed Packaging of Photovoltaic Cells for Energy Autonomous Embedded Sensors”, IEEE Sensors Conference,, Rotterdam, The Netherlands, Oct. , 2020.
  72. R. Chirila, M. Ntagios, R. Dahiya, “3D Printed Wearable Exoskeleton Human-Machine Interfacing Device”, IEEE Sensors Conference,, Rotterdam, The Netherlands, Oct. , 2020.
  73. A. Nag, R. Dahiya, S. Mitra, “A Low-Power Wide Supply Range Delay-Line based IC for Amperometric Measurement”, 24th European Conference on Circuit Theory and Design (ECCTD),, Sofia, Bulgaria, Sept. , 2020.
  74. M. Bhattacharjee, P. Escobedo, F. Nikbakhtnasrabadi, R. Dahiya, “NFC based Polymer Strain Sensor for Smart Packaging”, 33rd URSI GASS, Aug , 2020.
  75. M. Ntagios, P. Escobedo, R. Dahiya, “3D Printed Robotic Hand with Embedded Touch Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  76. P. Escobedo, L. Manjakkal, M. Ntagios, R. Dahiya, “Flexible Potentiostat Readout Circuit Patch for Electrochemical and Biosensor Applications”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  77. A. Ejaz, S. Dervin, R. Dahiya, “Printed nitrogen-doped graphene oxide-based sensor for uric acid detection”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  78. S. Dervin, A. Ejaz, R. Dahiya, “Facile, low-cost GO-CS screen printed carbon electrode for electrochemical detection of Tyrosine”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  79. O. Ozioko, Y. Kumaresan, R. Dahiya, “Carbon Nanotube/PEDOT: PSS Composite based Flexible Temperature Sensor with Enhanced Response and Recovery Time”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  80. A. Dahiya, R. Dahiya, “Synthesis of Multi-functional ZnO Nanomaterials on Flexible Substrates for Flexible Electronics”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  81. P. Karipoth, R. Dahiya, “Printed Piezoresistive Strain sensors for Wearable Systems”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  82. A. Ejaz, R. Dahiya, “Influence of Water and Ethanol Molecular Geometry in Determining Growth Kinetics of ZnO-Nanorods”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  83. A. Christou, F. Liu, R. Dahiya, “Assessing the stability of the printed NWs by in situ SEM characterisations”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  84. D. Sakthivel, A. Christou, R. Dahiya, “VLS Growth of Semiconducting Nanowires: Kinetic Analysis”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  85. Y. Kumaresan, O. Ozioko, R. Dahiya, “Effect of Dielectric and Stiffness of Soft Material between the Electrodes of a Capacitive Pressure Sensor on its Performance”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  86. F. F. Franco, L. Manjakkal, R. Dahiya, ” Screen-Printed Flexible Carbon versus Silver Electrodes for Electrochemical Sensors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  87. M. Willander, O. Nur, R. Dahiya, “Emerging sustainable sensors based on nanostructures on flexible and disposable substrates”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  88. E. S. Hosseini, L. Manjakkal, D. Shakthivel, R. Dahiya, “Glycine-based Flexible Biocompatible Piezoelectric Pressure Sensor for Healthcare Applications”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  89. A. Zumeit, D. Shakthivel, R. Dahiya, “Si Nanoribbons based High Performance Flexible FETs using Room-Temperature Process”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  90. A. Christou, R. Dahiya, “Touch Interactive 3D surfaces”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  91. O. Ozioko, H. Nassar, C. Muir, R. Dahiya, “3D Printed Capacitive Tilt Sensor”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  92. M. Bhattacharjee, P. Escobedo, F. Nikbakhtnasrabadi, R. Dahiya, “Printed Flexible Temperature Sensor with NFC Interface”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  93. A. Pullanchiyodan, L. Manjakkal, R. Dahiya, “Metal Coated Fabric Based Supercapacitors”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  94. P. Escobedo, M. Bhattacharjee, F. Nikbakhtnasrabadi, R. Dahiya, ” Flexible Strain Sensor with NFC Tag for Food Packaging”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  95. L. Manjakkal, A. Pullanchiyodan, E. S. Hosseini, R. Dahiya, “Flexible Supercapacitor with Sweat Equivalent Electrolyte for Safe and Sustainable Energy Storage”, The IEEE Int. Conf on Flexible and Printable Sensors and Systems (FLEPS 2020), Aug , 2020.
  96. M. Soni, D. Shakthivel, A. Christou, A. Zumeit, N. Yogeswaran, R. Dahiya, “High Performance Printed Electronics on Large Area Flexible Substrates”, IEEE Electron Devices Technology and Manufacturing (EDTM) conference, Penang, Malaysia, March , 2020.
  97. F. Liu, Y. Kumaresan, R. Dahiya, “Printing Quasi-1D Nanomaterials for Large-Area Flexible UV Photodetectors”, IEEE Electron Devices Technology and Manufacturing (EDTM) conference, Penang, Malaysia, March , 2020.
  98. D. Shakthivel, R. Dahiya, “Growth and Kinetics of Elemental and Binary Semiconducting Nanowires”, IEEE Electron Devices Technology and Manufacturing (EDTM) conference, Penang, Malaysia, March , 2020.
  99. N. Yogeswaran, A. Christou, F. Liu, R. Dahiya, “Contact Printed ZnO Nanowires based FET for Large Area Electronics”, IEEE Electron Devices Technology and Manufacturing (EDTM) conference, Penang, Malaysia, March , 2020.
  100. Y. Kumaresan, N. Yogeswaran, R. Dahiya, “Technologies for Realisation of Ultra-thin Chips”, IEEE Latin America Electron Devices conference (LAEDC), San Jose, Costa Rica, Feb , 2020.
  101. F. F. Franco, L. Manjakkal, D. Shakthivel, R. Dahiya, “ZnO based Screen Printed Aqueous Ammonia Sensor for Water Quality Monitoring”, IEEE Sensors 2019, Montreal, Canada, Oct. , 2019.
  102. O. Ozioko, M. Hersh, R. Dahiya, “Inductance-Based Soft and Flexible Pressure Sensors using Various Compositions of Iron Particles”, IEEE Sensors 2019, Montreal, Canada, Oct. , 2019.
  103. F. Liu, Y. Kumaresan, D. Shakthivel, R. Dahiya, “Large-area, Fast responding Flexible UV Photodetector realized by a Facile Method”, IEEE Sensors 2019, Montreal, Canada, Oct. , 2019.
  104. C. Smith, E. S. Hosseini, M. Riehle, A. Hart, R. Dahiya, “Piezoelectric plastic compressed collagen-mesh scaffold for artificial skin”, IEEE Sensors 2019, Montreal, Canada, Oct. , 2019.
  105. J. Neto, A. Zumeit, W. Navaraj, R. Dahiya, “Reliability Investigation of Via-bridges for Flexible Electronics”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  106. M. Bhattacharjee, A. Vilouras, R. Dahiya, “Microdroplet Based Organic Vapour Sensor on a Disposable GO-Chitosan Flexible Substrate”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  107. M. Soni, M. Bhattacharjee, R. Dahiya, “Printed Temperature Sensor Based on Graphene Oxide/PEDOT:PSS”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  108. L. Manjakkal, M. Soni, N. Yogeswaran, R. Dahiya, “Cloth Based Biocompatiable Temperature Sensor”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  109. F. Liu, A. Christou, R. Dahiya, “3D Integrated Electronics with Layer by Layer Printing of NWs”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  110. M. A. C. Angeli, F. Nikbakhtnasrabadi, P. Vena, R. Dahiya, “Geometry Dependent Application of Stretchable Printed Antenna”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  111. H. Nassar, A. Pullanchiyodan, M. Bhattacharjee, R. Dahiya, “3D Printed Interconnects on Bendable Substrates for 3D Circuits”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  112. M. Bhattacharjee, M. Soni, R. Dahiya, “Microchannel Based Flexible Dynamic Strain Sensor”, IEEE Int. Conf. on Flexible & Printable Sensors & Systems (FLEPS 2019), Glasgow, UK, July , 2019.
  113. F. Liu, R. Dahiya, “Flexible Logic Circuits by Using Van der Waals Contacted graphene Field-Effect Transistors”, The IEEE Int. Symposium on Circuits and Systems (ISCAS 2019), Sapporo, Japan, May , 2019.
  114. W. T. Navaraj, R. Dahiya, “Prosthetic Hand with Biomimetic Tactile Sensing and Force Feedback”, The IEEE Int. Symposium on Circuits and Systems (ISCAS 2019), Sapporo, Japan, May , 2019.
  115. L. Manjakkal, W. Dang, R. Dahiya, “Biodegradable Cloth with Printed Electrodes for Sensors and Energy Storage Devices”, 5th Conference on Innovations in Large Area Electronics (innoLAE 2019), Cambridge, UK, Jan , 2019.
  116. F. Liu, W. Taube, D. Sakthivel, R. Dahiya, “Contact Printing of Semiconducting Nanowires for High-Performance Large Area Flexible Electronics”, 5th Conference on Innovations in Large Area Electronics (innoLAE 2019), Cambridge, UK, Jan , 2019.
  117. L. Manjakkal, F. Nikbakhtnasrabadi, R. Dahiya, “Energy Autonomous Sensors for Water Quality Monitoring”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  118. D. Sakthivel, N. Yogeswaran, L. Manjakkal, R. Dahiya, “Flexible ZnO Nanowires-Graphene Stack by Hot Lamination Method”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  119. W. T. Navaraj, O. Ozioko, R. Dahiya, “Capacitive-Piezoelectric Tandem Architecture for Biomimetic Tactile Sensing in Prosthetic Hand”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  120. Md A. Kafi, A. Paul, A. Vilouras, R. Dahiya, “Chitosan-Graphene Oxide based ultra-thin conformable sensing patch for cell-health monitoring”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  121. A. Vilouras, A. Paul, Md A. Kafi, R. Dahiya, “Graphene Oxide-Chitosan Based Ultra-Flexible Electrochemical Sensor for Detection of Serotonin”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  122. M. Ntagios, W. T. Navaraj, R. Dahiya, “3D printed phalanx packaged with embedded pressure sensor”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  123. A. Paul, S. Gupta, R. Dahiya, “Corrugated Graphene Network based Pressure Sensor”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  124. E. S. Hosseini, L. Manjakkal, R. Dahiya, “Bio-organic Glycine based Flexible Piezoelectric Stress Sensor for Wound Monitoring”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  125. W. Dang, R. Dahiya, “Soft Robotic Finger with Integrated Stretchable Strain Sensor”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  126. N. Yogeswaran, S. Gupta, R. Dahiya, “Low Voltage Graphene FET Based Pressure Sensor”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  127. O. Ozioko, M. Hersh, R. Dahiya, “Inductance-based Flexible Pressure Sensor for Assistive Gloves”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  128. F. Liu, N. Yogeswaran, C. G. Núñez, D. Gregory, R. Dahiya, “Graphene-ZnO NWs film for large-area UV photodetector”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  129. S. Gupta, N. Yogeswaran, F. Giacomozzi, L. Lorenzelli, R. Dahiya, “Flexible AlN coupled MOSFET Device for Touch Sensing”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  130. H. Nassar, M. Ntagios, W. T. Navaraj, R. Dahiya, “Multi-Material 3D Printed Bendable Smart Sensing Structures”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  131. G. Min, L. Manjakkal, D. M. Mulvihill, R. Dahiya, “Enhanced triboelectric nanogenerator performance via an optimised low permittivity, low thickness substrate”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  132. C. G. Nunez, L. Manjakkal, F. Liu, R. Dahiya, “Contact-printing of Zinc Oxide Nanowires for Chemical Sensing Applications”, IEEE Sensors 2018, N. Delhi, India, Oct , 2018.
  133. O. Ozioko, W. Taube, N. Yogeswaran, M. Hersh, R. Dahiya, “Tactile Communication System for the Interaction between Deafblind and Robots”, The 27th IEEE Int. Symp. On Robot and Human Interactive Communication (RO-MAN), Nanjing, China, Aug , 2018.
  134. R. Dahiya, W. Taube, C. G. Nunez, D. Sakthivel, F. Liu, “Electronic Skin with Energy Autonomy and Distributed Neural Data Processing”, 4th Conference on Innovations in Large Area Electronics (innoLAE 2018), Cambridge, UK, Jan , 2018.
  135. A. Paul, M. A. Kafi, R. Dahiya, “Paper based Pressure Sensor for Green Electronics”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  136. M. A. Kafi, A. Paul, R. Dahiya, “Graphene Oxide-Chitosan based Flexible Biosensor”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  137. L. Manjakkal, C. L. Pascual, R. Dahiya, “Electrochemical sensors with screen printed Ag/AgCl/KCL reference electrodes”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  138. C. G. Nunez, W. Taube, F. Liu, R. Dahiya, “ZnO nanowires based flexible UV photodetectors for wearable dosimetry”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  139. C. G. Nunez, W. Taube, X. Liang, R. Dahiya, “Energy autonomous electronic skin for Robotics”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  140. W. Dang, L. Manjakkal, L. Lorenzelli, V. Vinciguerra, R. Dahiya, “Stretchable pH sensing patch in a hybrid package”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  141. S. Gupta, L. Lorenzelli, R. Dahiya, “Multifunctional Flexible PVDF-TrFE/BaTiO3 based Tactile Sensor for Touch and Temperature monitoring”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  142. N. Yogeswaran, D. Shakthivel, L. Lorenzelli, V. Vinciguerra, R. Dahiya, “Novel method for Plasmon enhanced Graphene based IR photodetectors”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  143. A. Vilouras, W. Taube, N. Yogeswaran, H. Heidari, R. Dahiya, “Flexible pressure sensing system for tongue-based control of prosthetic hands”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  144. F. Liu, W. Taube, N. Yogeswaran, D. Gregory, R. Dahiya, “Transforming the short-term sensing stimuli to long-term e-skin memory”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  145. D. Shakthivel, N. Yogeswaran, R. Dahiya, “Towards graphene based flexible force sensor”, IEEE Sensors, Glasgow, UK, Nov , 2017.
  146. A. Vilouras, R. Dahiya, “Compact Model for Flexible Ion-Sensitive Field Effect Transistor”, IEEE BIOCAS, Turing, Italy, Oct , 2017.
  147. W. Taube, N. Yogeswaran, V. Vinciguerra, R. Dahiya, “Simulation Study of Junctionless Silicon Nanomembrane FETs for High-Performance Printable Electronics”, ECCTD 2017 – 23rd European Conference on Circuit Theory and Design, Catania, ITALY, Sept , 2017.
  148. N. Yogeswaran, Z. Tang, V. Vinciguerra, R. Dahiya, “Bending Effects in a Flexible Dual Gated Graphene FET: a Verilog-A Model Implementation”, ECCTD 2017 – 23rd European Conference on Circuit Theory and Design, Catania, ITALY, Sept , 2017.
  149. X. Liang, H. Heidari, R. Dahiya, “Wearable Capacitive-based Wrist-worn Gesture Sensing System”, NGCAS 2017 – 2017 New Generation of Circuits and Systems, Genoa, ITALY, Sept , 2017.
  150. O. Ozioko, W. Taube, M. Hersh, R. Dahiya, “SmartFingerBraille:A Tactile Sensing and Actuation based Communication Glove for Deafblind People”, IEEE ISIE – 26th IEEE Int. Symp. on Ind. Electronics, Edinburgh, UK, June , 2017.
  151. D. Shakthivel, F. Liu, C. G. Nuñez, W. Taube, R. Dahiya, “Nanomaterials Processing for Flexible Electronics”, IEEE ISIE – 26th IEEE Int. Symp. on Ind. Electronics, Edinburgh, UK, June , 2017.
  152. S. Gupta, A. Vilouras, H. Heidari, R. Dahiya, “Device Modelling of Silicon based High-Performance Flexible Electronics”, IEEE ISIE – 26th IEEE Int. Symp. on Ind. Electronics, Edinburgh, UK, June , 2017.
  153. W. Dang, L. Lorenzelli, V. Vinciguerra, R. Dahiya, “Spray-coated stretchable interconnects”, IEEE ISIE – 26th IEEE Int. Symp. on Ind. Electronics, Edinburgh, UK, June , 2017.
  154. W. Taube, D. Shakthivel, C. García Núñez, F. Liu, D. Gregory, R. Dahiya, “Metal-assisted Chemical Etched Si Nanowires for High-Performance Large Area Flexible Electronics”, innoLAE 2017 – 3rd Conf. on innovations in Large Area Electronics, Cambridge, UK, Feb , 2017.
  155. H. Heidari, F. Liu, R. Dahiya, “Magnetoelectronics on Bendable Ultra-Thin Si Chips”, innoLAE 2017 – 3rd Conf. on innovations in Large Area Electronics, Cambridge, UK, Feb , 2017.
  156. W. Taube, F. Liu, A. Vilouras, D. Sakthivel, C. G. Nunez, H. Heidari, F. Labeau, D. Gregory, R. Dahiya, “Nanowire FETs based Neural Network for Tactile Pattern Recognition in E-Skin”, BIOCAS 2016, Shanghai, China, Oct , 2016.
  157. R. Dahiya, “Large Area Electronic Skin”, IEEE Sensors 2016, Orlando, USA, Oct , 2016.
  158. S. Wen, H. Heidari, A. Vilouras, R. Dahiya, “A Wearable Fabric-Based RFID Skin Temperature Monitoring Patch”, IEEE Sensors 2016, Orlando, USA, Oct , 2016.
  159. H. Heidari, C. G. Núñez, R. Dahiya, “Heterogeneously Integrated Graphene and CMOS Circuitry for Flexible Capacitive Touch Sensing”, IEEE Sensors 2016, Orlando, USA, Oct , 2016.
  160. W. Dang, V. Vinciguerra, L. Lorenzelli, R. Dahiya, “Metal-Organic Dual Layer Structure for Stretchable Interconnects”, Eurosensors 2016, Budapest, Hungary, Sept , 2016.
  161. A. Polishchuk, W. T. Navaraj, H. Heidari, R. Dahiya, “Multisensory Smart Glove for Tactile Feedback in Prosthetic Hand”, Eurosensors 2016, Budapest, Hungary, Sept , 2016.
  162. S. Gupta, F. Giacomozzi, H. Heidari, L. Lorenzelli, R. Dahiya, “Fabrication of Ultra-Thin Silicon based Flexible Piezoelectric Capacitive Sensor”, Eurosensors 2016, Budapest, Hungary, Sept , 2016.
  163. A. Vilouras, H. Heidari, W.T. Navaraj, R. Dahiya, “At home computer-aided myoelectric training system for wrist prosthesis”, Eurohaptics 2016, London, UK, July , 2016.
  164. S. Gupta, H. Heidari, L. Lorenzelli, R. Dahiya, “Towards Bendable Piezoelectric Oxide Semiconductor Field Effect Transistor Based Touch Sensor”, ISCAS 2016, IEEE Int. Symposium on Circuits and Systems, Montreal, Canada, May , 2016.
  165. H. Heidari, W. T. Navaraj, G. Toldi, R. Dahiya, “Device Modelling of Bendable MOS Transistors”, ISCAS 2016, IEEE Int. Symposium on Circuits and Systems, Montreal, Canada, May , 2016.
  166. E. O. Polat, R. Dahiya, “Synthesis of Large Area Graphene for High Performance in Flexible Optoelectronic Devices”, innoLAE 2015 – 2nd Conf. on innovations in Large Area Electronics, Cambridge, UK, Feb , 2016.
  167. D. Shakthivel, W. T. Navaraj, C. G. Núñez, F. Liu, R. Dahiya, “Transfer Printing Si Nanowires for Flexible Large Area Electronics”, innoLAE 2016 – 2nd Conf. on innovations in Large Area Electronics, Cambridge, UK, Feb , 2016.
  168. H. Heidari, S. Gupta, R. Dahiya, “Simulation Scenarios of Ultra-Thin Chips in Smart Large-Area Flexible Electronics”, innoLAE 2016 – 2nd Conf. on innovations in Large Area Electronics, Cambridge, UK, Feb , 2016.
  169. S. Gupta, H. Heidari, L. Lorenzelli, R. Dahiya, “Device modelling of POSFET for large area touch sensing application”, innoLAE 2016 – 2nd Conf. on innovations in Large Area Electronics, Cambridge, UK, Feb , 2016.
  170. S. Hannah, D. Uttamchandani, R. Dahiya, H. Gleskova, “Static force sensing enabled by P(VDF-TrFE) sensor coupled with organic thin-film transistor”, innoLAE 2016 – 2nd Conf. on innovations in Large Area Electronics, Cambridge, UK, Feb , 2016.
  171. H. Heidari, E. Bonizzoni, U. Gatti, F. Maloberti, R. Dahiya, “Optimal Geometry of CMOS Voltage-Mode and Current-Mode Vertical Magnetic Hall Sensors”, IEEE SENSORS 2015, The 14th IEEE Conf. on Sensors, Busan, Korea, Nov , 2015.
  172. W. R. Taube, H. Heidari, D. Shakthivel, D. Bhatia, R. Dahiya, “Prosthetic Limb Control Using Toe Gesture Sensors”, IEEE SENSORS 2015, The 14th IEEE Conf. on Sensors, Busan, Korea, Nov , 2015.
  173. N. Yogeswaran, S. Khan, W. Dang, E. O. Polat, L. Lorenzelli, V. Vinciguerra, R. Dahiya, “Tuning Electrical Conductivity of MWCNTs/PDMS Nanocomposites for Flexible Electronics”, IEEE Nano 2015, The 15th IEEE Int. Conf. on Nanotechnology, Rome, Italy, July , 2015.
  174. S. Hannah, S. Khan, H. Gleskova, R. Dahiya, “Response of p(VDF-TrFE) Sensors to Force and Temperature”, IEEE PRIME 2015 – 11th Int. Conf. on PhD Research in Microelectronics & Electronics, Glasgow, UK, July , 2015.
  175. H. Heidari, N. Wacker, S. Roy, R. Dahiya, “Towards Bendable CMOS Magnetic Sensors”, IEEE PRIME 2015 – 11th Int. Conf. on PhD Research in Microelectronics & Electronics, Glasgow, UK, July , 2015.
  176. W. Dang, S. Khan, L. Lorenzelli, V. Vinciguerra, R. Dahiya, “Stretchable Interconnects using Screen Printed Nanocomposites of MWCNTs with PDMS and P(VDF-TrFE)”, IEEE PRIME 2015 – 11th Int. Conf. on PhD Research in Microelectronics & Electronics, Glasgow, UK, July , 2015.
  177. S. Khan, N. Yogeswaran, L. Lorenzelli, R. Dahiya, “Si Microwires based FETs on Flexible Substrates”, IEEE PRIME 2015 – 11th Int. Conf. on PhD Research in Microelectronics & Electronics, Glasgow, UK, July , 2015.
  178. S. Khan, N. Yogeswaran, W. Taube, R. Dahiya, “Spice Model of a Piezoelectric Transducer for Lossless Pulse-Echo System”, IEEE PRIME 2015 – 11th Int. Conf. on PhD Research in Microelectronics & Electronics, Glasgow, UK, July , 2015.
  179. N. Yogeswaran, S. Tinku, S. Khan, L. Lorenzelli, V. Vinciguerra, R. Dahiya, “Stretchable Resistive Pressure Sensor based on CNT-PDMS Nanocomposites”, IEEE PRIME 2015 – 11th Int. Conf. on PhD Research in Microelectronics & Electronics, Glasgow, UK, July , 2015.
  180. E. O. Polat, O. Balci, N. Kakenov, C. Kokabas, R. Dahiya, “Synthesis of Graphene on Ultra-Smooth Copper Foils for Large Area Flexible Electronics”, IEEE PRIME 2015 – 11th Int. Conf. on PhD Research in Microelectronics & Electronics, Glasgow, UK, July , 2015.
  181. S. Tinku, C. Collini, R. Dahiya, L. Lorenzelli, “Smart Contact Lens with Passive Structures”, 2014 IEEE Sensors Int. Conf., Valencia, Spain, Nov 3-5, , 2014.
  182. S. Khan, R. Dahiya, S. Tinku, L. Lorenzelli, “Conformable Tactile Sensing using Screen Printed P(VDF-TrFE) and MWCNT/PDMS Composites”, 2014 IEEE Sensors Int. Conf., Valencia, Spain, Nov 3-5, , 2014.
  183. P. Cosseddu, L. Seminara, L. Pinna, S. Lai, R. Dahiya, M. Valle, M. Capurro, A. Bonfiglio, “Tactile Sensors Based on the Integration of a Piezoelectric Polymer with Low Voltage Organic Thin-Film Transistors”, 2014 IEEE Sensors Int. Conf., Valencia, Spain, Nov 3-5, , 2014.
  184. S. Khan, R. Dahiya, L. Lorenzelli, “Flexible Thermoelectric Generator Based on Transfer Printed Si Microwires”, ESSDERC 2014 – the 44th European Solid-State Device Research Conf., Venice, Italy, Sept 22-26, , 2014.
  185. S. Khan, R. Dahiya, L. Lorenzelli, “Screen Printed MWNT/PDMS Composite for Piezoresistive Flexible Sensors”, PRIME 2014 – The 10th Int. Conf. on PhD Research in Microelectronics and Electronics, Grenoble, France, July 1-3, , 2014.
  186. S. Khan, R. Dahiya, L. Lorenzelli, “Screen Printed Flexible Sensors Electronic Skin”, ASMC 2014 – The 25th Advanced Semiconductor Manufacturing Conf., Saratoga Springs, NY, USA, May 19-21, , 2014.
  187. S. Tinku, C. Collini, S. Pedrotti, R. Dahiya, L. Lorenzelli, “Metallization on polymer substrates for the fabrication of functional contact lenses”, CIMTEC 2014 – the 13th Int. Ceramics Congress & 6th Forum on New Materials, Montecatini Terme, Italy, June 15-20, , 2014.
  188. R. Dahiya, A. Adami, C. Collini, M. Valle, L. Lorenzelli, “POSFET Tactile Sensing Chips using CMOS Technology”, 2013 IEEE SENSORS Int. Conf., Baltimore, Maryland, USA, 4-6 Nov , 2013.
  189. R. Dahiya, “Towards Ultra-thin High-Performance Bendable Electronic Skin”, IEEE Conf. on Robotics and Automation (ICRA), Karlsruhe, Germany, 6-10 May , 2013.
  190. R. Dahiya, A. Adami, C. Collini, L. Lorenzelli, “Bendable Ultra-Thin Silicon Chips on Foil”, 2012 IEEE Sensors Int. Conf., Taipei, Taiwan, 28-31 Oct , 2012.
  191. R. Dahiya, L. Lorenzelli, “Removing Cured PDMS from Micro/Nano-structures”, MNE 2012, the 38th Int. Conf. on Micro & Nano Engineering, Toulouse, France, 16-20 Sept , 2012.
  192. R. Dahiya, A. Adami, C. Collini, L. Lorenzelli, “Large and Ultra-thin Chips on Flexible Foils”, MNE 2012, the 38th Int. Conf. on Micro & Nano Engineering, Toulouse, France, 16-20 Sept , 2012.
  193. R. Dahiya, A. Adami, C. Collini, L. Lorenzelli, “POSFET Tactile Sensing Arrays using CMOS Technology”, 26th European Conf. on Solid-State Transducers – EUROSENSORS 2012, Krakow, Poland, 9-12 Sept , 2012.
  194. R. Dahiya, “Towards Flexible Integrated Systems over Large Areas”, CIMTEC 2012 – The 4th Int. Conf. on Smart Materials, Structures and Systems (Symposium E – Next Generation Micro/Nano Systems), Montecatini Terme, Italy, June , 2012.
  195. R. Dahiya, and L. Lorenzelli, “Towards Silicon based Flexible Electronic Skin”, Int. Workshop “forum be-flexible 2011”, Munich, Germany, 23-24 Nov , 2011.
  196. R. Dahiya, L. Lorenzelli, A. Adami, C. Collini, “Bendable POSFET Tactile Sensing Chips”, Int. Workshop “forum be-flexible 2011”, Munich, Germany, 23-24 Nov , 2011.
  197. R. Dahiya, A. Adami, L. Lorenzelli, “Fabrication of Single Crystal Silicon Mirco-/Nanowires and Transferring them to Flexible Substrates”, MNE 2011, The 37th Int. Conf. on Micro and Nano Engineering, Berlin, Germany, September, pp 1-2 , 2011.
  198. R. Dahiya, “Flexible Electronics and Sensors over Large Areas”, Marie Curie Researchers Symposium: SCIENCE – Passion, Mission, Responsibilities, Warsaw, Poland, September, pp 229 , 2011.
  199. A. Adami, R. Dahiya, C. Collini, D. Cattin, L. Lorenzelli, “POSFET Touch Sensor With on-chip Electronic Module for Signal Conditioning”, TRANSDUCERS 2011 – The 16th IEEE Int. Conf. on Solid-State Sensors, Actuators & Microsystems, Beijing, China, pp 1982 – 1985, June , 2011.
  200. B. Torre, R. Dahiya, L. Lorenzelli, R. Cingolani, “Atomic Force Microscope – an Effective tool for Measuring Piezoelectric Constants of soft Materials”, The Piezo 2011 Conf., Sestriere, Italy, Feb , 2011.
  201. R. Dahiya, B. Torre, L. Lorenzelli, A. Diaspro, R. Cingolani, “Influence of temperature on polarization of piezoelectric polymers”, 3rd Topical meeting on Composite Materials of Inorganic Nanotubes and Polymers (COINAPO), Sestriere, Italy, March , 2011.
  202. L. Barboni, R. Dahiya, G. Metta, M. Valle, “Interface Electronics Design for POSFET Devices Based Tactile Sensing Systems”, IEEE ROMAN 2010, 19th IEEE Int. Symposium in Robot and Human Interactive Communication, Viareggio, Italy, pp 696-690, Aug. , 2010.
  203. R. Dahiya, L. Lorenzelli, G. Metta, M. Valle, “CMOS Implementation of POSFET Tactile Sensing Arrays with On Chip Readout”, SENSORCOMM 2010, The 4th Int. Conf. on Sensor Technologies and Applications, Venice, Italy, pp 80-83, July , 2010.
  204. D. Cattin, R. Oboe, R. Dahiya, M. Valle, “Identification and Validation of a Lumped Parameters Model for the Dielectric Relaxation of a Piezoelectric Tactile Sensor”, IEEE – ISIE 2010, The IEEE Int. Symposium on Industrial Electronics, Bari, Italy, July , 2010.
  205. L. Pinna, R. Dahiya, M. Valle, G. M. Bo, “Analysis of Self-Powered Vibration-Based Energy Scavenging System”, IEEE-ISIE 2010, The IEEE Int. Symposium on Industrial Electronics, Bari, Italy, July , 2010.
  206. R. Dahiya, L. Lorenzelli, G. Metta, M. Valle, “POSFET Devices Based Tactile Sensing Arrays”, IEEE – ISCAS 2010, The IEEE Int. Symposium on Circuits & Systems, Paris, France, pp 893-896, May , 2010.
  207. D. Cattin, R. Oboe, R. Dahiya, M. Valle, “Identification and Validation of a Fractional Order Dynamic Model for a Piezoelectric Tactile Sensor”, IEEE-AMC2010, The 11th Int. Workshop on Advanced Motion Control, Nagaoka, Japan, March , 2010.
  208. G. Cannata, R. Dahiya, M. Maggiali, F. Mastrogiovanni, G. Metta, M. Valle, “Modular Skin for Humanoid Robot Systems”, CogSys2010, The 4th Int. Conf. on Cognitive Systems, Zurich, Switzerland, Jan , 2010.
  209. L. Pinna, R. Dahiya, M. Valle, “SPICE Model for Piezoelectric Bender Generators”, IEEE-ICECS’09, The16th Int. Conf. on Electronics, Circuits and Systems, Tunisia, Dec. , 2009.
  210. F. Brunetti, C. Iaquinti, R. Dahiya, M. Valle, L. Lorenzelli, “Study of organic thin file transistors for the realization of tactile sensors”, Futurmat1, The First Int. Meeting on Organic Materials for a Better Future, Ostuni, Italy, Sept. , 2009.
  211. R. Dahiya, M. Valle, R. Oboe, D. Cattin, “Development and Characterization of Touch Sensing Devices for Robotic Applications”, IEEE IECON 2009, The 35th Annual Conf. of the IEEE Industrial Electronics Society, Porto, Portugal, Nov. , 2009.
  212. R. Dahiya, B. Torre, R. Cingolani, G. Sandini, “Voltage tunable sensitivity of Piezoelectric materials based Sensors and Actuators”, IEEE NANO 2009, The 9th IEEE Int. Conf. on Nanotechnology, Genova, Italy, July , 2009.
  213. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, A. Adami, “Design and Fabrication of POSFET Devices for Tactile Sensing”, TRANSDUCERS 2009, The 15th IEEE Int. Conf. on Solid-State Sensors, Actuators & Microsystems, Denver, Colorado, USA, June , 2009.
  214. R. Dahiya, M. Valle, G. Metta, “Touch Sensing by Piezoelectric Polymer Oxide Semiconductor Field Effect Transistor (POSFET) Devices”, IEDST 2009, 2nd IEEE Int. Workshop on Electron Devices and Semiconductor Technology, Mumbai, India, June , 2009.
  215. R. Dahiya, M. Gori, G. Metta, G. Sandini, “Better Manipulation with Human Inspired Tactile Sensing”, Proc. of Robotics Science and Systems (RSS 2009) Workshop on Understanding the Human Hand for Advancing Robotic Manipulation, Seattle, USA, June , 2009.
  216. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, “Bio-inspired Tactile Sensing Arrays”, Bioengineered and Bio-inspired Systems, SPIE Europe Conf. on Microtechnologies for new Millennium, Dresden, Germany, 7365, May , 2009.
  217. R. Dahiya, G. Metta, M. Valle, “Development of Fingertip Tactile Sensing Chips for Humanoid Robots”, IEEE-ICM 2009, IEEE-IES Int. Conf. on Mechatronics, Malaga, Spain, April , 2009.
  218. R. Dahiya, M. Valle, L. Lorenzelli, G. Metta, and S. Pedrotti, “Deposition Processing and Characterization of PVDF-TrFE Thin Films for Sensing Applications”, IEEE SENSORS 2008, The 7th IEEE Conf. on Sensors, Lecce, Italy, , 2008.
  219. R. Dahiya, M. Valle, G. Metta, “System Approach: A paradigm for Robotic Tactile Sensing”, IEEE- AMC08, The 10th Int. Workshop on Advanced Motion Control, Trento, Italy, Vol. 1, March , 2008.
  220. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, “Modeling of Lossy piezoelectric polymers in SPICE”, Proceedings of The 15th SPIE Int. Symposium on Smart Structures and Materials & Nondestructive Evaluation and Health Monitoring, San Diego, USA, Vol. 69260Y, March , 2008.
  221. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, “SPICE Model of Lossy Piezoelectric Polymers”, IEEE- ISAF 2008, The 17th Int. Symposium on Applications of Ferroelectrics, Santa Fe, USA, Vol. 3, , 2008.
  222. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, “POSFET Based Tactile sensor arrays”, IEEE-ICECS’07, The 14th Int. Conf. on Electronics, Circuits and Systems, Marrakech, Morocco, Dec , 2007.
  223. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, C. Collini, “Tactile sensing arrays for humanoid robot”, IEEE- PRIME’07, The 3rd Int. Conf. on PhD research on Microelectronics & Electronics, Bordeaux, France, July , 2007.
  224. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, “Tactile sensing arrays for humanoid robots”, Robotics Science and Systems (RSS 2007) Manipulation Workshop: Sensing and adapting to the Real World, Atlanta, USA, June , 2007.
  225. National Conference(s):

  226. L. Barboni, M. Valle, R. Dahiya, “POSFET touch sensing devices: bias circuit design based on the gm/Id parameter”, AISEM 2011, The XVI Annual Conf. on Sensors and Microsystems, Rome, Italy, , 2011.
  227. R. Dahiya, D. Cattin, A. Adami, C. Collini, L. Barboni, M. Valle, L. Lorenzelli, R. Oboe, G. Metta, F. Brunetti, “Design and Implementation of POSFET based Tactile Sensing Systems”, AISEM 2011, The XVI Annual Conf. on Sensors and Microsystems, Rome, Italy, , 2011.
  228. R. Dahiya, G. Metta, M. Valle, L. Lorenzelli, “Piezoelectric Polymer Oxide Semiconductor Field Effect Transistor (POSFET) Devices for Touch Sensing”, 41st Riunione Annuale Gruppo Elettronica, Trento, 17-19 June , 2009.
  229. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, “Piezoelectric Polymer – FET Devices Based Touch Sensors”, The First National Congress on Bioengineering, Pisa, Italy, June , 2008.
  230. R. Dahiya, M. Valle, G. Metta, L. Lorenzelli, “Tactile sensing arrays for humanoid robot”, Gruppo Eletronica Annual meeting (GE2007), Lerici, Italy, June , 2007.
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